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STCSN: Self-Timed intelligent Communication Structures for Network-on-Chip


This project focuses on developing intelligent on-chip self-timed communication structures for future globally-asynchronous locally-synchronous massive network-on-chip applications. The goal is to develop a communication platform, which is highly parallel, scalable and capable of providing high throughput. The platform needs to be error-tolerant in order to answer reliability demands of the near-future systems. For this, the communication structures need to be intelligent to detect and adapt to permanent physical faults and soft-errors caused by external and internal noises. This is essential to guarantee reliable data transaction even if there is faulty communication links.